TFS Financial, a leading provider of finance solutions for manufacturers, dealers, resellers, and marketplaces, has unveiled its latest offering: the Technology Infrastructure Financing Module. This cutting-edge finance solution empowers resellers to fund crucial infrastructure components such as chips, servers, cooling units, networks, and other essential assets.
Recent data from Grandview Research highlights a significant growth trajectory for the enterprise technology market, projecting an annualized increase of over 35% by 2030. This surge is driven by substantial investments in artificial intelligence and other emerging technologies. However, the financial burden of implementing hardware and physical assets can be daunting, with costs potentially exceeding $350,000 per site. This is based on average expenses for GPUs, servers, storage units, sensors, cameras, and other hardware components.
The Technology Infrastructure Financing Module offers a compelling solution for dealers, managed service providers (MSPs), and system integrators. It provides access to competitive financing options that can be branded according to each channel partner’s preferences. This enables partners to expedite deal closures and strengthen customer relationships by offering a dependable financing solution tailored to business needs.
The Technology Infrastructure Bundle is a comprehensive, outsourced turnkey finance and insurance (F&I) function that includes the following key elements:
Multi-Lender Platform: TFS Financial’s proprietary multi-lender platform dynamically matches borrowers with suitable financing providers. This matching is based on an algorithm that evaluates the borrower’s credit profile, down payment, asset specifications, and other relevant factors. The platform is designed to identify financing providers across the entire credit spectrum, from prime to subprime, ensuring that buyers who may face credit challenges can still complete transactions.
Dedicated Financial Services Team: TFS Financial’s dedicated services team manages the entire financing process, from collecting customer data and negotiating terms to handling documentation and providing post-deal support. As an outsourced solution, this team alleviates all financing workloads from internal staff while delivering top-tier service to buyers.
Aaron Case, president of TFS Financial, emphasized the industry’s need for such a solution. “We speak with businesses and channel partners regularly, and there is a consensus that companies are eager to leverage advanced technology to enhance their operations. However, the high costs associated with necessary hardware and equipment are a major deterrent,” Case stated. “We developed the Technology Infrastructure Bundle to address this challenge. It is a full-service white-label financing solution that offers competitive funding more swiftly and easily than other sources. We collaborate directly with the channel, enabling partners to enhance their brand value while providing a reliable, competitive, and accessible financing option to businesses.”
The introduction of the Technology Infrastructure Financing Module by TFS Financial marks a significant step forward in bridging the gap between financial needs and technological advancements. By offering a robust, turnkey financing solution, TFS Financial is empowering channel partners to seize opportunities in a rapidly evolving market landscape.
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Note: This article is inspired by content from https://www.monitordaily.com/news-posts/tfs-financial-introduces-white-labeled-technology-infrastructure-financing-module-for-channel-partners/. It has been rephrased for originality. Images are credited to the original source.